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China's 3G, RF Module for TD-SCDMA UMLC1-111B

 

Features

Variations limited and stable performance achieved by utilizing simulation technology and matching IC optimization.

 

  • Compatible with 3GPP TS25.102 Power Class 2 (+24dBm).
  • Realizes industry's smallest size of 13.0×9.0×1.5mm (W×D×H).
  • Stable high output and low-noise design for exceptional linearity.
  • Shield configuration with adoption of metal cover.
  • For RoHS and lead-free soldering.

 

Applications

  • Mobile phones, smart phones, data cards, etc.

 

Typical Specifications

 

Items
min.
typ.
max.
Operating temperature
-30°C
-
+85°C
Frequency
2010MHz min.
-
2025MHz max.
Supply voltage PA
3.2V
3.5V
4.2V
Supply voltage RF
2.75V
2.85V
2.95V
Transmission output
26.5dBm/BW
-
-
Power leaked to adjacent channel (ACLR 1.6MHz offset)
-
-38dBc
-34dBc
Reception output NF
-
4.7dB
-
Dimensions (W×D×H)
13.0×9.0×1.5mm

 

Dimensions

 

 

Example of circuit configuration

 

Documents and Downloads

Document File Type File Size Download
Datasheet PDF 327 KB
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