BFM Reed Relay- Comus

Comus International is proud to introduce the BFM series to our growing reed relay Menu. The new BFM series is a high reliability instrumentation grade relay for use in Instrumentation, automatic test equipment probe cards and load boards

 

The new BFM series takes practical advantage of Comus’ vertical manufacturing capabilities. Our COTO Technology BV reed switch is used exclusively in every reed relay we make which allows for the lowest industry lead times, superior quality, stable contact resistance, and the very best in reed relay performance.

 

BFM Reed Relay- Comus - Drawing

 

BFM Reed Relay- Comus

The BFM series are industry standard footprint 1Form A and 1Form C potted relays with external metal shells to reduce magnetic interaction. The BFM relays also offer optional Electrostatic and Coaxial (50Ω impedance) shields and are ideal for use in high frequency applications.

 

Interface Boards or DUT load boards for LSI, VLSI, Memory & Analog/Mixed signal ATE Test Systems require consistent and repeatable test results. Load boards for expensive ATE testers are constantly being pushed to new limits and with this need for new and innovative reed relays. The requirements of RF, stable contact resistance, faster testing and keeping test costs down are an absolute must.

 

Features

  • High Reliability Instrumentation Grade (Coto) reed switch with sputtered Ruthenium contacts
  • 1 Form A and 1 Form C contacts
  • Industry Standard Footprints
  • Ideal for Test and Instrumentation applications
  • Hermetically sealed contacts for long life
  • Optional Electrostatic Shield or Coaxial (50Ω impedance).
  • High Insulation Resistance: 1012 Ω MIN (Form A)
  • Metal Cover (reduces magnetic interaction)
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Datasheet PDF 503 KB